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Professionals in Indium, Gold Tin Alloy, Rhodium, Titanium, Hard SIlver, Hard Gold, Stainless Steel and more


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Now compatible with BARREL PLATING
Originally limited to Rack and Mesh. Plating, Mitsuya's Rhodium Plating faced. constraints in production quantity and product scope. Now, with compatibility for Barrel Plating, this advancement enables plating for a broader range of shapes while retaining consistent coating performance.
KEY FEATURES
Wear Resistance
Abrasion Resistance
Corrosion Resistance
Electrical Resistance
Contact Resistance
• Processing Method:
Rack Plating
Mesh Plating
Barrel Plating
• Purity 97-99.9%
• Hardness 750-1000 HV
• Maximum Thickness 1μm
• Materials Processed:
Copper (and its alloys)
Brass
Beryllium copper
Et cetera
• Product Dimensions:
0.3x6.5 mm
(pin shape)
• Processing Volume:
Consultation required
APPLICATION
• Sensors
• Semiconductor ICs
• Wafers
• Optical Electronics

Eco-wise, Quality Rise.

Gotanda Plant ISO9001 ECO Stage 3*

Hachioji Plant ISO9001 JISQ9100** KES*

Kofu Plant ISO9001

Yonezawa Plant ISO9001 ECO Stage 3*








*Equivalent to ISO14001
**Equivalent to AS9100 and EN9100
KES: Kyoto Environmental Management System

Discover the innovative indium plating technology designed
to meet the demanding needs of modern industries.

LOW MELTING POINT
Ideal for low-temperature bondingmaterials and metal seals
UNIFORM COATINGProvides consistent surface properties on metal surfaceCHEMICAL STABILITY
Excellent resistance to organic acids in lubrication oilTARNISH RESISTANCE
Valuable for anti-tarnish coatings on silver platingWEAR RESISTANCE & LUBRICITY Suitable for sliding bearings





LEARN HOW MITSUYA'S INDIUM PLATING CAN BENEFIT YOUR BUSINESS.

Lead-free solder suitable for
high-temperature, high-strength, and high-reliability
connections.

Why use AuSn Alloys
• Eco-friendly Soldering Solutions
Solderable without Flux
Lead-free (ROHS Compliant)• Corrosion and Oxidation Resistance• High Strength Connections
High Bond Strength
Excellent Wettability
Excellent Tensile Strength• Thermal Performance
Reliability at High Temperatures
High Melting Point (280°C)
High Thermal Conductivity (High Heat Dissipation)
Low Coefficient of Thermal Expansion
Thermal Fatigue Resistance
AuSn Alloy Plating
• Precision Film Thickness
Thinner Plating Film (VS conventional solder/methods) Coating Uniformity (Tolerances +lum)
High Dimensional Accuracy (Fine Pattern Deposition)• Alloy Composition
Uniform and Stable Composition
Eutectic and Non-Eutectic Compositions• High-Output Productivity
High Productivity (Rack Plating, Barrel Plating, Robot Line)
Applicable Plating for Various Fields
APPLICATION
• Sensors
• Semiconductor ICs
• Wafers
• Optical Electronics

• Gold Plating • Silver Plating • Tin Plating
Mitsuya's innovative direct plating By reducing processing steps and
eliminates the need for a traditional nickel underlayer, crucial in medical applications to prevent nickel allergies. This advanced technique is available for gold, silver, and tin plating, with gold offering both rack and hoop methods.
By reducing processing steps and improving adhesion, Mitsuya's direct plating technologies offer efficient, high- performance solutions for various industries, enhancing the performance and reliability of stainless steel components.

Gold Plating on SUS
Direct gold plating enhances stainless steel with superior conductivity, corrosion resistance, antimicrobial properties, wear resistance, and thermal conductivity. This versatile technique finds critical applications in diverse sectors like medical devices, electronics, aerospace, and
telecommunications.

Silver Plating on SUS
Direct silver plating enhances stainless steel, improving conductivity, corrosion resistance, wear resistance, solderability, and aesthetics. This versatile technique finds critical applications in electronics, medical devices, aerospace, and luxury goods.

Tin Plating on SUS
Direct tin plating enhances stainless steel, improving corrosion resistance, solderability, and conductivity, while offering wear resistance and a protective coating. This versatile technique finds critical applications in electronics, automotive, and other industries.
